pb free plating product IDP30E60 30amperes,600volts switchmode ultrafast recovery epitaxial diode pb ultrafast recovery time soft recovery characteristics low recovery loss low forward voltage high surge current capability low leakage current application general description freewheeling, snubber, clamp inversion welder pfc plating power supply ultrasonic cleaner and welder converter & chopper ups product feature IDP30E60 using lastest matured fred fab process(planar passivation pellet) with ultrafast and soft recovery characteristics. IDP30E60 ? 1995 thinki semiconductor co., ltd. http://www.thinkisemi.com.tw/ page 1/2 rev.08t to-220ac/to-220cb-2p absolute maximum ratings parameter symbol test conditions values units repetitive peak reverse voltage v rrm 600 v continuous forward current i f(av) tc =110 c 30 single pulse forward current i fsm tc =25 c 240 maximum repetitive forward current i frm square wave, 20khz 55 a operating junction tj 175 c storage temperatures tstg -55 to +175 c electrical characteristics (ta=25 c unless otherwise specified) parameter symbol test conditions min typ. max. units breakdown voltage blocking voltage v br , v r i r =100 a 600 i f =30a 1.30 1.60 forward voltage (per diode) v f i f =30a, tj =125 c 1.05 1.40 v v r = v rrm 20 reverse leakage current(per diode) i r tj=150 c, v r =600v 200 a i f =0.5a, i r =1a, i rr =0.25a 35 45 reverse recovery time(per diode) t rr i f = 1 a, v r =30v, di/ dt =-200a/us 28 35 ns thermal characteristics paramter symbol typ units junction-to-case r jc 1.6 /w internal configuration cathode(bottom side metal heatsink) cathode anode base backside
IDP30E60 electrical performance (typic) 0 . 1 0 1 . 0 0 1 0 . 0 0 1 0 0 . 0 0 0 0 . 2 0 . 4 0 . 6 0 . 8 1 1 . 2 1 . 4 1 . 6 1 . 8 f o r w a r d c u r r e n t i f ( a ) f o r w a r d v o l t a g e v f ( v ) f o r w a r d c h a r a c t e r i s t i c ( t y p . ) t a = 2 5 t a = 1 2 5 0 . 0 0 0 . 0 1 0 . 1 0 1 . 0 0 1 0 . 0 0 1 1 0 1 0 0 r e v e r s e c u r r e n t i r ( u a ) r e v e r s e v o l t a g e v r ( v ) r e v e r s e c h a r a c t e r i s t i c ( t y p . ) t a = 2 5 t a = 1 2 5 package information to-220ac package dimensions(millimeters) symbol min. max. a 4.30 4.70 a1 1.17 1.37 a2 2.20 2.60 b 0.60 1.00 b1 1.17 1.37 b2 1.90 2.30 c 0.30 0.70 e 2.34 2.74 e 9.70 10.1 e1 8.50 8.90 h 15.5 15.9 h1 9.00 9.40 h2 1.10 1.50 h3 1.50 1.90 h4 12.58 13.58 h5 2.80 3.20 g 2.60 3.00 p 3.40 3.80 ? 1995 thinki semiconductor co., ltd. http://www.thinkisemi.com.tw/ page 2/2 rev.08t
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